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US 2013/0093076 A1Published application
Semiconductor package and method of forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWei-Hung LIN, Ming-Da CHENG, Chung-Shi LIU, Mirng-Ji LII, Chen-Hua YU
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Abstract
A method of a semiconductor package includes providing a substrate having a conductive trace coated with an organic solderability preservative (OSP) layer, removing the OSP layer from the conductive trace, and then coupling a chip to the substrate to form a semiconductor package.
Claims20
A method, comprising:
- receiving a substrate comprising a conductive trace coated with an organic solderability preservative (OSP) layer;
- removing at least a portion of the OSP layer from the conductive trace;
- and
- coupling a chip to the substrate to form a semiconductor package after removing the at least a portion of the OSP layer.
1 more element
A structure, comprising:
- a substrate;
- and
- a conductive trace on the substrate, wherein the conductive trace is free of an organic solderability preservative (OSP) layer.
A semiconductor package, comprising:
- a substrate comprising a conductive trace;
- and
- a chip comprising a bump structure, wherein the bump structure is coupled to the conductive trace to form a bump-on-trace (BOT) interconnection in the semiconductor package;
- wherein the semiconductor package is free of an organic solderability preservative (OSP) layer between the bump structure and the conductive trace.
1 more element
Dependencies are inferred from the claim text.