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US 2013/0093075 A1Published application
Semiconductor Device Package and Method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHao-Juin Liu, Chita Chuang, Chen-Cheng Kuo, Chen-Shien Chen
Life of this patent
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Abstract
An embodiment is a structure. The structure comprises a substrate, a chip, and a reinforcement component. The substrate has a first surface, and the first surface comprises depressions. The chip is over and attached to the first surface of the substrate. The reinforcement component is over a first area of the first surface of the substrate. The first area is not under the chip. The reinforcement component has a portion disposed in at least some of the depressions in the first area.
Claims20
A structure comprising:
- a substrate having a first surface, the first surface comprising depressions;
- a chip over and attached to the first surface of the substrate;
- and
- a reinforcement component over a first area of the first surface of the substrate, the first area not being under the chip, the reinforcement component having a portion disposed in at least some of the depressions in the first area.
1 more element
A structure comprising:
- a substrate having depressions in a top surface;
- a chip attached to the top surface;
- an underfill material between the top surface of the substrate and the chip, the underfill material being in at least some of the depressions in a first area of the top surface of the substrate, the first area underlying the chip;
- and
- a component selected from the group consisting essentially of a lid and a first adhesive, a ring and a second adhesive, and a molding compound, the component being on the top surface of the substrate and having a portion disposed in at least some of the depressions in a second area of the top surface of the substrate, the second area not underlying the chip.
2 more elements
A method comprising:
- providing a substrate having depressions in a top surface;
- attaching a chip to the top surface of the substrate;
- and
- providing a reinforcement component on the top surface of the substrate, a portion of the reinforcement component being disposed in at least some of the depressions.
1 more element
Dependencies are inferred from the claim text.