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US 2013/0093074 A1Published application
Multi-die integrated circuit structure with heat sink
AssigneeXilinx, Inc.
InventorDouglas M. Grant
Life of this patent
Estimating the term…
Abstract
An integrated circuit structure can include a first die including a first surface and a second surface and a second die including a first surface and a second surface. The first surface of the first die can be coupled to the second surface of the second die. The integrated circuit structure also can include a heat sink coupled to the first surface of the first die and the first surface of the second die.
Claims21
An integrated circuit structure, comprising:
- a first die comprising a first surface and a second surface;
- a second die comprising a first surface and a second surface;
- wherein the first surface of the first die is coupled to the second surface of the second die;
- and
- a heat sink coupled to the first surface of the first die and the first surface of the second die;
- wherein the first die is an interposer and comprises at least one thermal wire coupled to the heat sink.
3 more elements
(canceled)
An integrated circuit structure, comprising:
- an interposer comprising a first wire and a second wire;
- a first die coupled to a surface of the interposer;
- a second die coupled to the surface of the interposer;
- wherein the first die and the second die are communicatively linked through the interposer by the first wire;
- and
- a heat sink coupled to the interposer, the first die, and the second die;
- wherein the heat sink is coupled to the second wire;
- and
- wherein the second wire is not configured to propagate an electrical signal.
6 more elements
An integrated circuit structure, comprising:
- an interposer;
- a first die coupled to a surface of the interposer;
- a second die coupled to the surface of the interposer;
- a heat sink coupled to the interposer, the first die, and the second die;
- and
- a package at least partially encompassing the interposer, the first die, and the second die;
- wherein the heat sink forms a top portion of the package.
4 more elements
Dependencies are inferred from the claim text.