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US 2013/0093073 A1Published application
High thermal performance 3d package on package structure
AssigneeMediatek Inc.
InventorsTai-Yu CHEN, Chun-Wei CHANG, Chung-Hwa WU
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Abstract
A package on package (PoP) structure is disclosed. The PoP structure includes a top package and a bottom package disposed thereunder. The top package includes a first substrate and a first die mounted onto the first substrate. The first substrate has a thermal conductivity which is more than 70 W/(m×K). The bottom package includes a second substrate and a second die mounted onto the second substrate. An upper surface of the second die is in thermal contact with a lower surface of the first substrate.
Claims19
A package on package structure, comprising:
- a top package comprising a first substrate and a first die mounted onto the first substrate, wherein the first substrate has a thermal conductivity which is more than 70 W/(m×K);
- and
- a bottom package disposed under the top package, comprising a second substrate and a second die mounted onto the second substrate, wherein an upper surface of the second die is in thermal contact with a lower surface of the first substrate.
A package on package structure, comprising:
- a top package comprising a first substrate and a first die mounted onto the first substrate, wherein at least one electrically floating pad is disposed on a lower surface of the first substrate;
- and
- a bottom package disposed under the top package, comprising a second substrate and a second die mounted onto the second substrate, wherein an upper surface of the second die is in thermal contact with the electrically floating pad.
Dependencies are inferred from the claim text.