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US 2013/0093072 A1Published application
Leadframe pad design with enhanced robustness to die crack failure
AssigneeStmicroelectronics Pte Ltd
InventorsXueren Zhang, Wingshenq Wong, Kim-Yong Goh, Yiyi Ma
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Abstract
A leadframe includes a die pad and a protective wall surrounding the die pad. A semiconductor die is situated on the die pad. Indentations are formed on the four inner corners of the protective wall adjacent the corners of the semiconductor die.
Claims19
A device comprising:
- a die pad having a top surface;
- a semiconductor die on the top surface of the die pad;
- a support wall surrounding the die pad;
- a molding compound covering the support wall and the semiconductor die;
- and
- an indentation in the support wall at an inner corner of the support wall adjacent a corner of the semiconductor die.
3 more elements
A method comprising:
- forming a die pad having a top surface configured to receive a semiconductor die;
- forming a protective wall surrounding the die pad;
- and
- forming an indentation on an inner corner of the protective wall adjacent a corner of the die pad.
1 more element
A device comprising:
- a rectangular die pad having a top surface;
- a rectangular protective wall surrounding the die pad and having four inner corners;
- and
- a plurality of corner indentations on the inner corners of the protective sidewall.
1 more element
Dependencies are inferred from the claim text.