Optical module with a lens encapsulated within sealant and method for manufacturing the same
AssigneeSumitomo Electric Industries, Ltd.
InventorsKazunori Tanaka, Kazuaki Mii, Toshio Takagi, Tomomi Sano, Keitaro Koguchi
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Abstract
A method to manufacture an optical module is disclosed, wherein the optical module has an optically active device on a lead frame and a lens co-molded with the active device and the lead frame by a transparent resin as positioning the lens with respect to the lead frame. The molding die of the present invention has a positioning pin to support the lens during the molding. Because the lead frame is aligned with the molding die, the precise alignment between the active device on the lead frame and the lens is not spoiled during the molding.
Claims14
An optical module, comprising:
- a semiconductor optical device;
- a lead frame for mounting said semiconductor optical device;
- a lens optically coupled with said semiconductor optical device;
- and
- a sealant for enclosing said semiconductor optical device, said lens and a portion of said lead frame, said sealant being transparent for light characterizing said semiconductor optical device,
- wherein said sealant has at least a via penetrating from a surface of said sealant to said lens.
A method to manufacture an optical module, comprising steps of:
- setting a lead frame on a molding die, wherein said read frame mounts a semiconductor optical device thereon;
- supporting a lens by a portion of said molding die in a position optically aligned with said semiconductor optical device;
- and
- molding said lens, said semiconductor optical device, and said lead frame by a resin transparent for light characterizing said semiconductor optical device to form a sealant enclosing said lens, said semiconductor optical device and said lead frame.
Dependencies are inferred from the claim text.