Package structure and the method to fabricate thereof
AssigneeCyntec Co., Ltd.
InventorsBAU-RU LU, JENG-JEN LI, CHIANG KAIPENG
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Abstract
The invention discloses a package structure made of the combination of a metallic substrate and a lead frame. In one embodiment, a recess is formed in the metallic substrate and a first conductive element having at least one first I/O terminal is bonded in the recess. A lead frame is formed on the metallic substrate and comprises a plurality of electrical connections to connect with said at least one first I/O terminal of the first conductive element. In another embodiment, another conductive element is disposed in the vacancy of the lead frame. The invention also discloses a method for manufacturing a package structure made of the combination of a metallic substrate and a lead frame.
Claims20
A package structure, comprising:
- a metallic substrate;
- a recess in the metallic substrate;
- a first conductive element having at least one first I/O terminal in the recess;
- and
- a first lead frame on the metallic substrate, wherein the first lead frame comprises a plurality of first electrical connections to connect with said at least one first I/O terminal of the first conductive element.
A method for manufacturing a package structure, the method comprising the steps of:
- a. providing a metallic substrate;
- b. forming a recess in the metallic substrate;
- c. placing a first conductive element having at least one first I/O terminal in the recess;
- and
- d. forming a lead frame on the metallic substrate, wherein the lead frame comprises a plurality of electrical connections to connect with said at least one first I/O terminal of the first conductive element.
Dependencies are inferred from the claim text.