Bonded substrate and method of manufacturing the same
AssigneeSamsung Corning Precision Materials Co., Ltd.
InventorsJoong Won Shur, Donghyun Kim, Dong-Woon Kim, Mikyoung Kim, MinJu Kim, Seung Yong Park, Bohyun Lee, BongHee Jang
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Abstract
A bonded substrate having a plurality of grooves and a method of manufacturing the same. The method includes the following steps of implanting ions into a first substrate, thereby forming an ion implantation layer, bonding the first substrate to a second substrate having a plurality of grooves in one surface thereof such that the first substrate is bonded to the one surface, and cleaving the first substrate along the ion implantation layer.
Claims8
A method of manufacturing a bonded substrate comprising:
- implanting ions into a first substrate, thereby forming an ion implantation layer;
- bonding the first substrate to a second substrate having a plurality of grooves in one surface thereof such that the first substrate is bonded to the one surface;
- and
- cleaving the first substrate along the ion implantation layer.
A bonded substrate comprising:
- a first thin substrate;
- and
- a second substrate bonded with the first thin substrate, the second substrate having a plurality of grooves in a surface thereof which is bonded to the first thin substrate.
Dependencies are inferred from the claim text.