Systems and methods for air-release in cavity packages
AssigneeAnalog Devices, Inc.
InventorsJia Gao, Jicheng Yang, Shafi Saiyed, Siu Lung Ng, Xiaojie Xue
Life of this patent
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Abstract
A housing for integrated devices that includes an air-release mechanism is disclosed. This is achieved, in various embodiments, by forming a vent hole in a package substrate, and arranging a package lid over the package substrate. The vent hole allows air to be released from within the cavity package, thereby ensuring that the package lid remains stably affixed to the package substrate despite increased temperatures during processing. The vent hole may be sealed upon mounting the package onto a mounting substrate.
Claims54
A device package comprising:
- a package housing defining a cavity;
- a motion sensor die mounted within the housing;
- and
- a hole extending through the housing.
A device package comprising:
- a package substrate having an upper surface and a bottom surface, the package substrate comprising:
- a leadframe;
- and
- a molding material surrounding portions of the leadframe;
- wherein a hole extends through the leadframe from the upper surface of the package substrate to the bottom surface of the package substrate.
A device package comprising:
- a package substrate having an upper surface and a bottom surface;
- a hole extending from the upper surface of the package substrate to the bottom surface of the package substrate, wherein a portion of the hole intersects the bottom surface and defines a perimeter on the bottom surface of the package substrate;
- and
- an annular metal trace positioned substantially around the perimeter of the hole.
A method of integrating a motion sensor with an outside electronic circuit, the method comprising:
- providing a package substrate with a vent hole therethrough;
- mounting a motion sensor die on the package substrate;
- and
- attaching a lid to the package substrate to form a housing enclosing the motion sensor die but for the vent hole.
A method of mounting a packaged motion sensor device to an external board comprising:
- providing a package housing comprising a cavity, a motion sensor die mounted within the housing, and a vent hole extending through the housing;
- and
- simultaneously mounting the package housing to an external board and sealing the vent hole.
Dependencies are inferred from the claim text.