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US 2013/0093030 A1Published application
Unattached contained semiconductor devices
AssigneeRosemount Aerospace Inc.
InventorsScott D. Isebrand, Nghia T. Dinh, Andrew S. Paule, Ben P. Fok
Life of this patent
Estimating the term…
Abstract
An unattached, contained semiconductor device includes a semiconductor die, for example a MEMS pressure sensor die. The semiconductor die is unattached from the interior cavity of a surrounding containment body in that the semiconductor die is free of adherence to the containment body to mitigate packaging stress and strain between the containment body and the semiconductor die.
Claims20
A semiconductor device package comprising:
- a containment body defining an interior cavity and an exterior with a plurality of electrical contacts each extending from the interior cavity to the exterior;
- and
- a semiconductor die housed within the interior cavity with a plurality of wire bonds flexibly connecting the semiconductor die to the electrical contacts, wherein the semiconductor is free to move within the interior cavity of the containment body accommodated by flexure of the wire bonds to mitigate packaging stress and strain between the containment body and the semiconductor.
A semiconductor device package comprising:
- a containment body defining an interior cavity and an exterior with a plurality of electrical contacts each extending from the interior cavity to the exterior;
- and
- a semiconductor die in electrical communication with the electrical contacts of the containment body by way of a plurality of flexible wire bonds, wherein the wire bonds are the only fixed connection between the containment body and the semiconductor die, wherein the semiconductor die is free to move within the interior cavity of the containment body accommodated by flexure of the wire bonds to mitigate packaging stress and strain between the containment body and the semiconductor die.
A semiconductor device package comprising:
- a containment body defining an interior cavity and an exterior with a plurality of electrical contacts each extending from the interior cavity to the exterior;
- and
- a semiconductor die housed within the interior cavity wherein the semiconductor die is detached from the interior cavity and is free of adherence thereto to mitigate packaging stress and strain between the containment body and the semiconductor die.
Dependencies are inferred from the claim text.