US 2013/0092971 A1Published application

Light emitting diode packaging structure and manufacturing method thereof

AssigneeJiujiang Fared Optics Co., Ltd.

InventorJeong-Shiun Chen

Life of this patent

Estimating the term…

Loading patent…

Abstract

A light emitting diode (LED) packaging structure includes a substrate, a first transparent plastic layer, a second transparent plastic layer, an LED chip, fluorescent glue covering the LED chip and packaging plastic covering the substrate, the first transparent plastic layer and the fluorescent glue. The first and second transparent plastic layers are provided on the substrate. The LED chip is provided in the first enclosed flat pattern and the second enclosed flat pattern encloses the second transparent plastic layer. The first transparent plastic layer is higher than the LED chip and the second transparent plastic layer is higher than the first transparent plastic layer. The LED packaging structure does not require a leadframe and provides a broad emission angle of light.

Claims10

Dependent claims

A light emitting diode (LED) packaging structure, comprising:

a substrate;
at least one first transparent plastic layer provided on the substrate, the first transparent plastic layer having a first enclosed flat pattern with a first height;
a second transparent plastic layer provided on the substrate, the second transparent plastic layer having a second enclosed flat pattern with a second height, which encloses the first transparent plastic layer;
at least one LED chip bound to on the substrate by sliver paste or a eutectic process in a respective first enclosed flat pattern, the LED chip having a third height;
a fluorescent glue consisting a fluorescent powder and a transparent resin, wherein the fluorescent glue is provided in the first enclosed flat pattern and covers the LED chip and portions of the substrate within the first enclosed flat pattern;
and
a packaging plastic provided in the second enclosed flat pattern and covering the first transparent plastic layer and the substrate;
wherein, the second height is higher than the first height and the first height is higher than the third height.

5 more elements

A manufacturing method of an LED packaging structure, comprising steps of:

coating a first transparent material and a second transparent material on a substrate to form first and second transparent plastic layers, respectively, wherein the first transparent plastic layer has a first enclosed flat pattern and the second transparent plastic layer has a second enclosed flat pattern;
performing a first drying process at a first curing temperature to cure the first transparent plastic layer and the second transparent plastic layer, wherein the first curing temperature is greater than the curing temperature of the first transparent plastic layer and the curing temperature of the second transparent plastic layer;
binding at least one LED chip to the substrate by sliver paste or a eutectic process such that the LED chip is provided on the substrate within a respective first enclosed flat pattern;
coating a fluorescent glue to cover the LED chip and portions of the substrate within the first enclosed flat pattern;
performing a second drying process at a second curing temperature to cure the fluorescent glue, wherein the second curing temperature is greater than a curing temperature of the fluorescent glue;
coating a packaging plastic to cover the first transparent plastic layer, the fluorescent glue and portions of the substrate within the second enclosed flat pattern;
and
performing a third drying process at a third curing temperature to cure the packaging plastic, wherein the third curing temperature is greater than a curing temperature of the packaging plastic.

5 more elements

Dependencies are inferred from the claim text.