Process to manufacture surface fine grain copper foil with high peeling strength and environmental protection for printed circuit boards

A manufacturing method for fine grain surface copper foil with high peeling strength and environmental protection performances used for printed circuit boards, characterized in that:

• (1) Firstly the adhesion surface of copper foil is washed with an acidic solution consisting of copper sulfate and sulfuric acid to remove dirt or filth on the surface thereof;
• (2) The washed copper foil is dipped into a plating bath composed of copper sulfate pentahydrate, sulfuric acid and trace sodium phosphotungstate to electrodeposit a roughening treatment layer;
• (3) After water washing, it is electroplated with a plating solution composed of copper sulfate pentahydrate, sulfuric acid to form a roughening copper layer,
• (4) The resulted copper foil is washed with water, then the roughening copper layer thereof is electroplated in the same plating solution as (2) to form a composite metal layer;
• (5) Resulted copper foil is washed with water, and the composite metal layer then is plated in the same plating solution as (3) to form a fine grain surface copper foil.