Sputter deposition apparatus

A sputter deposition apparatus, comprising:

• a vacuum chamber;
• a vacuum evacuation device evacuating the inside of the vacuum chamber;
• a gas introduction system introducing a sputtering gas into the vacuum chamber;
• a target having a sputtering surface to be sputtered which is exposed inside the vacuum chamber;
• a magnet device arranged on a rear side of the sputtering surface of the target and movable relative to the target;
• and
• a power source device applying a voltage to the target,
• wherein the magnet device has a center magnet disposed with an orientation to generate a magnetic field on the sputtering surface and an outer peripheral magnet disposed in a continuous shape on a periphery of the center magnet,
• wherein the center magnet and the outer peripheral magnet are disposed in such a manner that the magnetic poles of reverse polarities thereof are oriented toward the sputtering surface,
• the sputter deposition apparatus, further comprising:
• an adhesion-preventing member made of insulating ceramic disposed at an end of the target,
• wherein a surface including the sputtering surface among the surface of the target is discontinuous, so as to surround a periphery of the sputtering surface, and
• wherein the magnet device moves between a position where the entire outer periphery of the outer peripheral magnet is on the inside of the inner periphery of the adhesion-preventing member surrounding the periphery of the sputtering surface and another position where a part of the outer periphery of the outer peripheral magnet protrudes to the outer periphery side beyond the inner periphery of the adhesion-preventing member surrounding the periphery of the sputtering surface.