Chip-on-film panel structure
AssigneeShenzhen China Star Optoelectronics Technology Co., Ltd.
InventorsMing-hung Shih, Meng Li
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AssigneeShenzhen China Star Optoelectronics Technology Co., Ltd.
InventorsMing-hung Shih, Meng Li
Estimating the term…
The present invention relates to a chip-on-film panel structure, which has a panel body and fan-out leads, first metal sheets, array leads and second metal leads thereon. The array leads are disposed at two sides of the fan-out leads, the second metal sheets are disposed at two sides of the first metal sheets, and the length of each of the second metal sheet is less than the length of each of the first metal sheet to form a lead-out area that the array leads are led out from the second metal sheets via the lead-out area. The chip-on-film panel structure having an arranged fan-out area for array leads can settle the problem of being difficult to narrow the frame of the panel because the array leads occupy available room for fan-out leads and force the fan-out area to expand longitudinally.
A chip-on-film panel structure comprising a panel body, a plurality of fan-out leads mounted on the panel body, a plurality of first metal sheets mounted on the panel body and used to be connected to the fan-out leads, a plurality of array leads mounted on the panel body and a plurality of second metal sheets mounted on the panel body and used to be connected to the array leads, characterized in that:
A chip-on-film panel structure comprising a panel body, a plurality of fan-out leads mounted on the panel body, a plurality of first metal sheets mounted on the panel body and used to be connected to the fan-out leads, a plurality of array leads mounted on the panel body and a plurality of second metal sheets mounted on the panel body and used to be connected to the array leads, characterized in that:
Dependencies are inferred from the claim text.