Multilayer adhesive sheet and method for manufacturing electronic component
AssigneeDenki Kagaku Kogyo Kabushiki Kaisha
InventorsTakeshi Saito, Kazunori Shikano
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AssigneeDenki Kagaku Kogyo Kabushiki Kaisha
InventorsTakeshi Saito, Kazunori Shikano
Estimating the term…
Provided is a multilayer adhesive sheet which enables easy separation between an adhesive layer and a die attach film during the pick-up even in cases where an acrylate ester copolymer is used in the die attach film, thereby making the pick-up work of semiconductor chips after the dicing easy. The multilayer adhesive sheet comprises a base film, an adhesive layer that is disposed on one surface of the base film, and a die attach film that is disposed on an exposed surface of the adhesive layer. The adhesive that constitutes the adhesive layer contains: (A) a (meth)acrylate ester copolymer; (B) an ultraviolet polymerizable compound; (C) a multifunctional isocyanate curing agent; (D) a photopolymerization initiator; and (E) a silicone polymer.
A multilayer adhesive sheet comprising a base film, an adhesive layer that is disposed on one surface of the base film, and a die attach film that is disposed on the exposed surface of the adhesive layer, the adhesive that constitutes the adhesive layer containing (A) a (meth)acrylic ester copolymer, (B) an ultraviolet polymerizable compound, (C) a multifunctional isocyanate curing agent, (D) a photopolymerization initiator, and (E) a silicone polymer, wherein:
Dependencies are inferred from the claim text.