Vacuum exhaust method and a substrate processing apparatus therefor
AssigneeTokyo Electron Limited
InventorsHidefumi Matsui, Tsuyoshi Moriya, Nobuyuki Nagayama
Life of this patent
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Abstract
A vacuum exhaust method of a substrate processing apparatus, after opening to the atmosphere, depressurizes a vacuum processing chamber having therein a mounting table for mounting a target substrate thereon. The vacuum exhaust method includes covering a surface of the mounting table with a protection member; sealing the vacuum processing chamber; vacuum evacuating the sealed vacuum processing chamber; and adsorbing at least one of foreign substances and out-gases by the protection member.
Claims9
A vacuum exhaust method of a substrate processing apparatus including a vacuum processing chamber having therein a mounting table for mounting a target substrate thereon, the vacuum exhaust method comprising:
- opening the vacuum processing chamber to the atmosphere;
- covering a surface of the mounting table with a protection member;
- sealing the vacuum processing chamber;
- vacuum evacuating the sealed vacuum processing chamber;
- and
- adsorbing at least one of foreign substances and out-gases by the protection member.
Dependencies are inferred from the claim text.