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AssigneeBroadcom Corporation
InventorsAhmadreza ROFOUGARAN, Arya Reza BEHZAD, Sam Ziqun ZHAO, Jesus Alfonso CASTANEDA, Michael BOERS
Estimating the term…
Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.
An integrated circuit formed onto a semiconductor substrate, the semiconductor substrate including a first group and a second group of useable fabrication layers from among a plurality of fabrication layers, comprising:
The integrated circuit of claim 7, wherein the cavity region is a region between the first conductive element and the second conductive element that is free of conductive material.
The integrated circuit of claim 8, wherein the region between the first conductive element and the second conductive element is configured and arranged to approximate free space.
The integrated circuit of claim 8, wherein the region between the first conductive element and the second conductive element includes at least one dielectric material.
An integrated waveguide formed onto a semiconductor substrate, the semiconductor substrate including a plurality of fabrication layers, comprising:
Dependencies are inferred from the claim text.