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US 2013/0077270 A1Published application
Circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same
AssigneeSamsung Electronics Co., Ltd.
InventorsHyo-Jae BANG, Dogeun KIM, Hongkyun KIM, Youngbok JEON
Life of this patent
Estimating the term…
Abstract
Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same, which are common to at least two different form factors.
Claims20
A circuit board, comprising:
- a board, common to at least a first form factor and a second form factor;
- and
- first circuit board connection terminals of the first form factor.
A case assembly, comprising:
- at least a top surface or a bottom surface, of a first form factor or a second form factor;
- a connector, attached to the top surface or the bottom surface, the connector including first circuit board connection terminals of the first form factor and second circuit board connection terminals of the second form factor;
- and
- a securing element attached to the top surface or the bottom surface;
- the connector including connector connection terminals, where only one of the first circuit board connection terminals and the second circuit board connection terminals are connected to the connector connection terminals.
2 more elements
A device, comprising:
- a case of one of a first form factor and a second form factor;
- a circuit board of the first form factor;
- first circuit board connection terminals of the first form factor;
- and
- second circuit board connection terminals of the second form factor.
2 more elements
A connector, comprising:
- first connector connection terminals of a first form factor;
- and
- second connector connection terminals of a second form factor.
A method of manufacturing a common circuit board, comprising:
- providing a board, common to at least a first form factor and a second form factor;
- forming first circuit board connection terminals of the first form factor on the board;
- and
- forming second circuit board connection terminals of the second form factor on the board.
1 more element
A method of manufacturing an assembly or device, comprising:
- combining at least two of a circuit board, a connector, and a case to form any one of a circuit board assembly, a case assembly, or a device.
Dependencies are inferred from the claim text.