N-shot antenna assembly and related manufacturing method
AssigneeEthertronics, Inc.
InventorsLaurent Desclos, Jeffrey Shamblin, Seong-Gi Jeong, Seung-Woong Choi, Cheol-Hun Seol, Won-Sui Lee
Life of this patent
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Abstract
An antenna module and a manufacturing method for the same are disclosed. With the miniaturization trend for mobile communication terminals, the invention can achieve the miniaturization of antenna modules and facilitate the design of the antenna. The SMD as a matching component for given resonance frequency and impedance matching of the antenna is mounted on the antenna module to make the antenna module compact, and functions as a matching circuit for impedance matching to facilitate the design of mobile devices.
Claims15
An antenna assembly for use in wireless devices, comprising:
- a carrier formed of non-conductive and plating-resistive resin material, and having one or more voids disposed on an outer surface thereof;
- plating-friendly filler material spanning a volume created by the voids on the outer surface of the carrier;
- conductive material disposed on a plated surface of the filler material forming a conductive pattern;
- a plating resist disposed on the filler material forming a discontinuous part of the conductive pattern;
- and
- at least one surfaced mounted device attached to the conductive pattern at said discontinuous part.
A method of manufacturing an antenna assembly for use in a wireless device, comprising the steps of:
- using plating-resistive and non-conductive resin material to form a carrier having one or more voids on an outer surface thereof;
- filling a volume of the voids with a plating-friendly filler material;
- on the filler material, attaching one or more plating resists adapted to resist conductive plating;
- forming conductive patterns by plating conductive material on the plating-friendly filler material, wherein the plating resists form a discontinuous part of the conductive patterns;
- and
- attaching a surface mounted device to the conductive portions at the discontinuous part.
An antenna assembly for use in wireless devices, comprising:
- a first layer, comprising:
- a first carrier formed of a first non-conductive and plating-resistive resin material, and having one or more voids disposed on an outer surface thereof;
- plating-friendly filler material spanning a volume created by the voids on the outer surface of the carrier;
- conductive material disposed on a plated surface of the filler material forming a conductive pattern;
- a plating resist disposed on the filler material forming a discontinuous part of the conductive pattern;
- and
- at least one surfaced mounted device attached to the conductive pattern at said discontinuous part;
- and
- a second layer;
- wherein said first layer and second layer are combined to form a multi-layer antenna assembly.
Dependencies are inferred from the claim text.