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US 2013/0076570 A1Published application
Rf module
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJung Aun LEE, Myeong Woo Han, Dong Woon Chang, Joun Sup Park, Chan Yong Jeong
Life of this patent
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Abstract
There is provided an RF module performing radio communications and allowing for a significantly reduced distance between an antenna and a semiconductor chip. To this end, the RF module includes a semiconductor chip; and a substrate including an anntenna unit formed by a circuit pattern thereon, and having a surface on which the semiconductor chip is mounted to be electrically connected to the antenna unit.
Claims14
An RF module, comprising:
- a semiconductor chip;
- and
- a substrate including an anntenna unit formed by a circuit pattern thereon, and having a surface on which the semiconductor chip is mounted to be electrically connected to the antenna unit.
Dependencies are inferred from the claim text.