Semiconductor chip, semiconductor device, and method of measuring the same
AssigneeElpida Memory, Inc.
InventorsToru ISHIKAWA, Machio SEGAWA
Life of this patent
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Abstract
In a semiconductor device in which semiconductor chips having a number of signal TSVs are stacked, a huge amount of man-hours have been required to perform a continuity test for each of the signal TSVs. According to the present invention, no continuity test is performed directly on signal TSVs. Dummy bumps are arranged in addition to signal TSVs. The dummy bumps of the semiconductor chips are connected through a conduction path that can pass the dummy bumps between the semiconductor chips with one stroke when the semiconductor chips are stacked. A continuity test of the conduction path allows a bonding defect on bonded surfaces of two of the stacked semiconductor chips to be measured and detected.
Claims19
A semiconductor device comprising:
- a first chip including a plurality of first bumps and a plurality of first wirings;
- and
- a second chip including a plurality of second bumps and a plurality of second wirings, and being stacked with the first chip such that each of the second bumps is coupled to a corresponding one of the first bumps of the first chip;
- wherein:
- the first wirings, the first bumps, the second wirings, and the second bumps constitute a single electrical path, and the first wirings, the first bumps, the second wirings and the second bumps are arranged in series with one another in the single electrical path.
A semiconductor chip comprising:
- a first surface and a second surface opposite to the first surface;
- a first group of dummy bumps on the first surface;
- a second group of dummy bumps on the second surface:
- and
- wirings which are placed within the semiconductor chip and which electrically connect the dummy bumps of the first and the second groups;
- wherein:
- the wirings include:
- first wirings which connect two of the dummy bumps of the first group;
- and
- second wirings which connect two of the dummy bumps of the second group.
A method of measuring a semiconductor device which has a plurality of semiconductor chips bonded to each other through dummy bumps of each semiconductor chip;
- comprising:
- constituting a single electrical path which extends through the dummy bumps and internal wirings of the plurality of the semiconductor chips connected to the dummy bumps and which is connected in series with the dummy bumps and the internal wirings of the plurality of the semiconductor chips;
- and
- detecting whether or not the single electrical path is normal.
Dependencies are inferred from the claim text.