Manufacturing method of light-emitting device and the light-emitting device
AssigneeToshiba Lighting & Technology Corporation
InventorsMiho Watanabe, Nobuhiko Betsuda, Hirotaka Tanaka
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Abstract
According to one embodiment, a manufacturing method for a light-emitting device includes: mounting a light-emitting element on a substrate; and dispersing, in liquid transparent resin, phosphor particles in micron order excited by light radiated from the light-emitting element to emit light and electrostatically applying or electrostatically spraying dispersed liquid of the phosphor particles to thereby form a layer including the phosphor particles on the upper surface of the light-emitting element.
Claims13
A manufacturing method for a light-emitting device comprising:
- mounting a light-emitting element on a substrate;
- and
- dispersing, in liquid transparent resin, phosphor particles in micron order excited by light radiated from the light-emitting element to emit light and electrostatically applying or electrostatically spraying dispersed liquid of the phosphor particles to thereby form a layer including the phosphor particles on an upper surface of the light-emitting element.
A light-emitting device comprising:
- a LED chip having a substrate on which a light-emitting element is mounted;
- a plurality of electrodes, mounted said LED chip, which supplies electrical power to the light-emitting element;
- and
- a phosphor layer provided on a region except said electrodes, a space between the electrodes and an outer circumference of said electrodes, of an upper surface of said LED chip
Dependencies are inferred from the claim text.