Led lamp
AssigneeBeat-Sonic Co., Ltd.
InventorTsutomu TOTANI
Life of this patent
Estimating the term…
Abstract
An LED lamp includes a heat dissipator, a module substrate on which an LED chip is mounted and fixed to one end of the dissipater, a lighting circuit supplying electric power to the LED chip, and a light guide fixed to the dissipator so that a base of the light guide is located opposite the LED chip. Light emitted from the LED chip is incident on the light guide through its base, the incident light radiating out of a surface of the light guide to be diffused around the light guide. The lamp further includes a heat-conducting column projecting from the one end of the dissipator. The column has a distal end on which the substrate is disposed. The substrate and at least an outer periphery of the column are covered by the light guide. The outer periphery is located near the column surface on which the substrate is disposed.
Claims3
An LED lamp comprising:
- a heat dissipator having two ends;
- a module substrate on which an LED chip is mounted, the module substrate being fixed to one end of the heat dissipator;
- a cap mounted on the other end of the heat dissipator:
- a lighting circuit supplying electric power to the LED chip and disposed in the heat dissipator, the lighting circuit being electrically connected to the cap;
- and
- a light guiding member fixed to the heat dissipator so that a base thereof is located opposite the LED chip,
- wherein light emitted from the LED chip is incident on the light guiding member through the base of the light guiding member, the incident light radiating out of a surface of the light guiding member to be diffused around the light guiding member,
- the LED lamp further comprising a heat-conducting column projecting from said one end of the heat dissipator, the heat-conducting column having a distal end on which the module plate is disposed,
- wherein the module substrate and at least an outer periphery of the heat-conducting column are covered by the light guiding member, said outer periphery being located near a surface of the heat-conducting column, on which surface the module substrate is disposed.
Dependencies are inferred from the claim text.