Acoustic wave device and fabrication method of the same
AssigneeTaiyo Yuden Co., Ltd.
InventorTomo KURIHARA
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AssigneeTaiyo Yuden Co., Ltd.
InventorTomo KURIHARA
Estimating the term…
A fabrication method of an acoustic wave device includes: forming acoustic wave elements on a first substrate; forming protrusion electrodes and seal rings on the first substrate simultaneously by an electrolytic plating method, the protrusion electrodes being electrically connected to the acoustic wave elements, each of the seal rings surrounding related acoustic wave elements out of the acoustic wave elements and related protrusion electrodes out of the protrusion electrodes electrically connected to the related acoustic wave elements; and cutting a plating power-supply line used in the electrolytic plating method in a step of dividing the first substrate into pieces each including a corresponding one of the seal rings so as to electrically separate the related acoustic wave elements from the corresponding one of the seal rings.
A fabrication method of an acoustic wave device comprising:
An acoustic wave device comprising:
Dependencies are inferred from the claim text.