High voltage chuck for a probe station
AssigneeCascade Microtech, Inc.
InventorsMichael E. Simmons, Kazuki Negishi, Roy Jensen, Ryan Garrison, Philip Wolf
Life of this patent
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Abstract
A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.
Claims15
A chuck comprising:
- (a) an upper conductive layer having a lower surface and an upper surface suitable to support a device under test;
- (b) an upper insulating layer having an upper surface at least in partial face-to-face contact with said lower surface of said upper conductive layer, and a lower surface;
- and
- (c) a middle conductive layer having an upper surface at least in partial face-to-face contact with said lower surface of said upper insulating layer, and a lower surface.
A method of isolating a high voltage chuck for a probe station comprising coating conductive surfaces proximate the chuck force/sense surface of said probe station with a non-conductive, low dielectric absorption coating.
A chuck force/sense layer to force/sense measurement lead connection for a chuck for testing an integrated circuit, said connection comprising at least one force/sense measurement lead extending from a terminal for attachment to measuring cabling, said lead extending through an insulating material and thereafter fastening to said chuck force/sense layer without depending upon said insulating material for clamping force or electrical connection with said chuck force/sense layer.
A chuck for testing an integrated circuit comprising an upper conductive layer having an upper surface suitable to support a device under test, said upper surface having thereon vacuum distribution for holding said device under test.
Dependencies are inferred from the claim text.