Apparatus and Methods for Molding Die on Wafer Interposers

A method, comprising:

• forming through silicon vias in a silicon wafer having a die side and an opposite side;
• mounting a plurality of integrated circuit dies on the die side of the silicon wafer, the integrated circuit dies having gaps between them and defining scribe line areas in at least some of the gaps between them;
• molding the plurality of integrated circuit dies and the die side of the silicon wafer with a mold compound;
• dicing the mold compound to form at least one stress relief trench extending into the mold compound in at least one of the gaps between the integrated circuit dies;
• and
• dispensing stress relief material different from the mold compound into the at least one stress relief trench to form at least one stress relief feature.

An apparatus, comprising:

• a plurality of integrated circuit dies mounted on a die side surface of an interposer, the integrated circuit dies having gaps between them, the interposer having an opposite side;
• at least one stress relief feature formed in one of the gaps;
• and
• mold compound surrounding the plurality of integrated circuit dies and the at least one stress relief feature.