Integrated circuit and method of making
AssigneeTexas Instruments Incorporated
InventorsBernardo Gallegos, Abram Castro
Life of this patent
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Abstract
Circuits and methods of fabricating circuits are disclosed herein. An embodiment of the circuit includes a die having a side, wherein a connection point is located on the side. A dielectric layer having a first side, a second side, and at least one via extending between the first side and the second side, is located proximate the side of the die. The via is electrically connected to the connection point. A conductive layer is located adjacent the second side of the first dielectric layer, wherein at least a portion of the conductive layer is electrically connected to the via.
Claims20
A circuit comprising:
- a die having a side, wherein a connection point is located on said side;
- a first dielectric layer having a first side, a second side, and at least one first via extending between said first side and said second side, wherein said first side of said first dielectric layer is located proximate said side of said die, and wherein said first via is electrically connected to said connection point;
- and
- a conductive layer having a first side and a second side, wherein said first side is located adjacent said second side of said first dielectric layer, at least a portion of said conductive layer being electrically connected to said first via.
A method of fabricating a circuit, said method comprising:
- providing a die, said die having a side, wherein a connection point is located on said side;
- affixing a first dielectric layer to said first side of said die, said first dielectric layer having a first side and a second side, wherein said first side of said first dielectric layer is affixed to said side of said die;
- and
- forming a first via through said first dielectric layer between said first side and said second side, wherein said first via is electrically connected to said connection point.
A method of fabricating a circuit, said method comprising:
- encapsulating a die with encapsulant except for a first side of said die;
- and
- after said encapsulating, attaching a dielectric substrate to said die and said encapsulant.
Dependencies are inferred from the claim text.