Integrated circuit packaging system with package stacking and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsJoHyun Bae, In Sang Yoon, DaeSik Choi
Life of this patent
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; applying a molded under-fill on the base substrate; forming a substrate contact extender through the molded under-fill and in direct contact with the base substrate; mounting a stack device over the molded under-fill; attaching a coupling connector from the substrate contact extender to the stack device; and forming a base encapsulation on the stack device, the substrate contact extender, and encapsulating the coupling connector.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- providing a base substrate;
- applying a molded under-fill on the base substrate;
- forming a substrate contact extender through the molded under-fill and in direct contact with the base substrate;
- mounting a stack device over the molded under-fill;
- attaching a coupling connector from the substrate contact extender to the stack device;
- and
- forming a base encapsulation on the stack device, the substrate contact extender, and encapsulating the coupling connector, the base encapsulation in directly contact with an under-fill top side of the molded under-fill.
A method of manufacture of an integrated circuit packaging system comprising:
- providing a base substrate;
- mounted a base integrated circuit on the base substrate;
- applying a molded under-fill on the base substrate and encapsulating the base integrated circuit;
- forming a chip contact extender through the molded under-fill and in direct contact with the base integrated circuit;
- mounting an intermediate integrated circuit on the molded under-fill and electrically coupled to the chip contact extender;
- and
- forming an intermediate encapsulation on the intermediate integrated circuit, the chip contact extender, and a portion of the molded under-fill.
A method of manufacture of an integrated circuit packaging system comprising:
- providing a base substrate;
- applying a molded under-fill on the base substrate;
- mounting an intermediate substrate on the molded under-fill;
- forming a substrate contact extender through the molded under-fill and through the intermediate substrate;
- mounting a coupling connector on the substrate contact extender;
- and
- mounting a stack device on the coupling connector.
An integrated circuit packaging system comprising:
- a base substrate;
- a molded under-fill on the base substrate;
- a substrate contact extender formed through the molded under-fill and in direct contact with the base substrate;
- a stack device mounted over the molded under-fill;
- a coupling connector attached from the substrate contact extender to the stack device;
- and
- a base encapsulation formed on the stack device, the substrate contact extender, and encapsulating the coupling connector, the base encapsulation in directly contact with an under-fill top side of the molded under-fill.
An integrated circuit packaging system comprising:
- a base substrate;
- a base integrated circuit on the base substrate;
- a molded under-fill on the base substrate and encapsulating the base integrated circuit;
- a chip contact extender through the molded under-fill and in direct contact with the base integrated circuit;
- an intermediate integrated circuit on the molded under-fill and electrically coupled to the chip contact extender;
- and
- an intermediate encapsulation on the intermediate integrated circuit, the chip contact extender, and a portion of the molded under-fill.
An integrated circuit packaging system comprising:
- a base substrate;
- a molded under-fill on the base substrate;
- an intermediate substrate mounted on the molded under-fill;
- a substrate contact extender through the molded under-fill and through the intermediate substrate;
- a coupling connector mounted on the substrate contact extender;
- and
- a stack device mounted on the coupling connector.
Dependencies are inferred from the claim text.