Integrated circuit packaging system with encapsulation and method of manufacture thereof
OwnerYeongIm Park, HeeJo Chi +1inventors
InventorsYeongIm Park, HeeJo Chi, HyungMin Lee
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a substrate having a substrate first side and a substrate second side opposite the substrate first side; attaching a base integrated circuit to the substrate first side; attaching a mountable integrated circuit to the substrate second side; attaching a via base to the substrate second side adjacent the mountable integrated circuit; forming a device encapsulation surrounding the via base and the mountable integrated circuit; and forming a via extension through the device encapsulation and attached to the via base, the via extension exposed from the device encapsulation.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- providing a substrate having a substrate first side and a substrate second side opposite the substrate first side;
- attaching a base integrated circuit to the substrate first side;
- attaching a mountable integrated circuit to the substrate second side;
- attaching a via base to the substrate second side adjacent the mountable integrated circuit;
- forming a device encapsulation surrounding the via base and the mountable integrated circuit;
- and
- forming a via extension through the device encapsulation and attached to the via base, the via extension exposed from the device encapsulation.
A method of manufacture of an integrated circuit packaging system comprising:
- providing a substrate having a substrate first side and a substrate second side opposite the substrate first side;
- attaching a base integrated circuit to the substrate first side;
- attaching a mountable integrated circuit to the substrate second side;
- attaching a via base to the substrate second side adjacent the mountable integrated circuit;
- forming a device encapsulation, having an encapsulation outer side facing away from the substrate second side, on the substrate second side surrounding the via base and the mountable integrated circuit;
- and
- forming a via extension through the device encapsulation and attached to the via base, the via extension exposed from the device encapsulation along the encapsulation outer side.
An integrated circuit packaging system comprising:
- a substrate having a substrate first side and a substrate second side opposite the substrate first side;
- a base integrated circuit attached to the substrate first side;
- a mountable integrated circuit attached to the substrate second side;
- a via base attached to the substrate second side adjacent the mountable integrated circuit;
- a device encapsulation surrounding the via base and the mountable integrated circuit;
- and
- a via extension through the device encapsulation and attached to the via base, the via extension exposed from the device encapsulation.
Dependencies are inferred from the claim text.