Integrated circuit packaging system with a substrate embedded dummy-die paddle and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsRui Huang, Xusheng Bao, Kang Chen, Yung Kuan Hsiao, Hin Hwa Goh
Life of this patent
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a dummy-die paddle having a first inactive side facing up, a second inactive side facing down; forming an insulator in a single continuous structure around and in direct contact with the first inactive side; and mounting an integrated circuit over the dummy-die paddle and the insulator, the integrated circuit and the dummy-die paddle having the same coefficient of thermal expansion as the dummy-die paddle.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- providing a dummy-die paddle having a first inactive side facing up, a second inactive side facing down;
- forming an insulator in a single continuous structure around and in direct contact with the first inactive side;
- and
- mounting an integrated circuit over the dummy-die paddle and the insulator, the integrated circuit and the dummy-die paddle having the same coefficient of thermal expansion as the dummy-die paddle.
A method of manufacture of an integrated circuit packaging system comprising:
- providing a temporary carrier;
- mounting a dummy-die paddle on the temporary carrier having:
- a first inactive side facing up,
- a second inactive side facing down, and
- outer sides terminating at the first inactive side and the second inactive side;
- mounting a lead frame with a pillar peripheral to the dummy-die paddle, and having:
- a top side on a top, and
- an exterior side terminating at the top side;
- forming an insulator having a top surface around the dummy-die paddle and in direct contact with the first inactive side and the outer sides and molded around the pillars in direct contact with the top side and in a single continuous structure;
- mounting an integrated circuit over the dummy-die paddle and the insulator, the integrated circuit and the dummy-die paddle having the same coefficient of thermal expansion as the dummy-die paddle;
- and
- removing the temporary carrier.
An integrated circuit packaging system comprising:
- a dummy-die paddle having a first inactive side facing up, a second inactive side facing down;
- an insulator in a single continuous structure around and in direct contact with the first inactive side;
- and
- an integrated circuit over the dummy-die paddle and the insulator, the integrated circuit and the dummy-die paddle having the same coefficient of thermal expansion as the dummy-die paddle.
Dependencies are inferred from the claim text.