Integrated circuit packaging system with chip stacking and method of manufacture thereof
AssigneeSTATS ChipPAC Pte. Ltd.
InventorsDaeSup Kim, YoungJoon Kim, DaeSik Choi
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a first substrate; mounting an integrated circuit structure on the first substrate; mounting a second substrate on the integrated circuit structure; coupling a vertical chip to the first substrate and to the second substrate; and forming a package body for encapsulating the integrated circuit structure, the vertical chip, and a portion of the second substrate.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- providing a first substrate;
- mounting an integrated circuit structure on the first substrate;
- mounting a second substrate on the integrated circuit structure;
- coupling a vertical chip to the first substrate and to the second substrate;
- and
- forming a package body for encapsulating the integrated circuit structure, the vertical chip, and a portion of the second substrate.
A method of manufacture of an integrated circuit packaging system comprising:
- providing a first substrate having a component side;
- mounting an integrated circuit structure on the component side;
- mounting a second substrate, having a substrate non-horizontal side and a second substrate contact, on the integrated circuit structure;
- coupling a vertical chip on the component side and attached to the second substrate contact;
- and
- forming a package body for encapsulating the component side, the integrated circuit structure, the vertical chip, and a portion of the second substrate.
An integrated circuit packaging system comprising:
- a first substrate;
- an integrated circuit structure mounted on the first substrate;
- a second substrate mounted on the integrated circuit structure;
- a vertical chip coupled to the first substrate and to the second substrate;
- and
- a package body for encapsulating the integrated circuit structure, the vertical chip, and a portion of the second substrate.
Dependencies are inferred from the claim text.