Coplaner waveguide transition
AssigneeRegents of the University of Minnesota
InventorsYoung Seek Cho, Rhonda Rene Franklin
Life of this patent
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Abstract
A coplanar waveguide transition includes a substrate, a first coplanar waveguide on a first side of the substrate, and a second coplanar waveguide on a second side of the substrate. The coplanar waveguide transition includes a first, a second, and a third via through the substrate electrically coupling the first coplanar waveguide to the second coplanar waveguide. The coplanar waveguide transition includes voids through the substrate between the first, second, and third vias and edges of the first coplanar waveguide and edges of the second coplanar waveguide.
Claims25
A coplanar waveguide transition comprising:
- a substrate;
- a first coplanar waveguide on a first side of the substrate;
- a second coplanar waveguide on a second side of the substrate;
- a first, a second, and a third via through the substrate electrically coupling the first coplanar waveguide to the second coplanar waveguide;
- and
- voids through the substrate between the first, second, and third vias and edges of the first coplanar waveguide and edges of the second coplanar waveguide.
A coplanar waveguide transition comprising:
- a substrate;
- a first ground plane and a second ground plane on a first side of the substrate;
- a first signal line on the first side of the substrate, the first signal line between the first ground plane and the second ground plane;
- a third ground plane and a fourth ground plane on a second side of the substrate opposite the first side;
- a second signal line on the second side of the substrate, the second signal line between the third ground plane and the fourth ground plane;
- a first via through the substrate electrically coupling the first signal line to the second signal line;
- a second via through the substrate electrically coupling the first ground plane to the third ground plane;
- a third via through the substrate electrically coupling the second ground plane to the fourth ground plane;
- a first void through the substrate between the first via and the second via;
- a second void through the substrate between the first via and the third via;
- a third void through the substrate between the second via and an edge of the first ground plane and an edge of the third ground plane;
- and
- a fourth void through the substrate between the third via and an edge of the second ground plane and an edge of the fourth ground plane.
A method for fabricating a coplanar waveguide transition, the method comprising:
- fabricating a first coplanar waveguide on a first side of a substrate;
- fabricating a second coplanar waveguide on a second side of the substrate;
- fabricating a first, a second, and a third via through the substrate to electrically couple the first coplanar waveguide to the second coplanar waveguide;
- depositing a dielectric material layer over each of the first and second sides of the substrate;
- structuring the dielectric material layer on the first side of the substrate to expose portions of the substrate between the first coplanar waveguide and the second coplanar waveguide;
- etching the exposed portions of the substrate to form trenches through the substrate;
- and
- removing the dielectric material layer on the first and second sides of the substrate.
A semiconductor device comprising:
- a first semiconductor chip;
- a second semiconductor chip;
- and
- a coplanar waveguide transition electrically coupling the first semiconductor chip to the second semiconductor chip, the coplanar waveguide transition comprising:
- a substrate;
- a first coplanar waveguide on a first side of the substrate, the first coplanar waveguide electrically coupled to the first semiconductor chip;
- a second coplanar waveguide on a second side of the substrate, the second coplanar waveguide electrically coupled to the second semiconductor chip;
- a first, a second, and a third via through the substrate electrically coupling the first coplanar waveguide to the second coplanar waveguide;
- and
- voids through the substrate between the first, second, and third vias and edges of the first coplanar waveguide and edges of the second coplanar waveguide.
Dependencies are inferred from the claim text.