US 2013/0075902 A1 · Semiconductor Device and Method of Forming Conductive Posts Embedded in Photosensitive Encapsulant

Abstract

A semiconductor package includes a post carrier having a base plate and plurality of conductive posts. A photosensitive encapsulant is deposited over the base plate of the post carrier and around the conductive posts. The photosensitive encapsulant is etched to expose a portion of the base plate of the post carrier. A semiconductor die is mounted to the base plate of the post carrier within the etched portions of the photosensitive encapsulant. A second encapsulant is deposited over the semiconductor die. A first circuit build-up layer is formed over the second encapsulant. The first circuit build-up layer is electrically connected to the conductive posts. The base plate of the post carrier is removed and a second circuit build-up layer is formed over the semiconductor die and the photosensitive encapsulant opposite the first circuit build-up layer. The second circuit build-up layer is electrically connected to the conductive posts.

Claims25

Dependent claims

A method of making a semiconductor device, comprising:

providing a substrate including a plurality of conductive posts extending from the substrate;
disposing a photosensitive material over the substrate and around the conductive posts;
forming an opening in the photosensitive material to expose a portion of the substrate between the conductive posts;
disposing a semiconductor die over the substrate within the opening in the photosensitive material;
and
depositing an encapsulant over the semiconductor die within the opening in the photosensitive material.

3 more elements

Dependencies are inferred from the claim text.

Semiconductor Device and Method of Forming Conductive Posts Embedded in Photosensitive Encapsulant

Life of this patent

Semiconductor Device and Method of Forming Conductive Posts Embedded in Photosensitive Encapsulant

Life of this patent

Abstract

Claims25