US 2013/0075898 A1 · SURFACE DEPRESSIONS FOR DIE-TO-DIE INTERCONNECTS AND ASSOCIATED SYSTEMS AND METHODS

Abstract

Stacked microelectronic dies employing die-to-die interconnects and associated systems and methods are disclosed herein. In one embodiment, a stacked system of microelectronic dies includes a first microelectronic die, a second microelectronic die attached to the first die, and a die-to-die interconnect electrically coupling the first die with the second die. The first die includes a back-side surface, a surface depression in the back-side surface, and a first metal contact located within the surface depression. The second die includes a front-side surface and a second metal contact located at the front-side surface and aligned with the first metal contact of the first die. The die-to-die interconnect electrically couples the first metal contact of the first die with the second metal contact of the second die and includes a flowable metal layer that at least partially fills the surface depression of the first die.

Claims14

Dependent claims

An interconnect structure for electrically coupling a first microelectronic die with a second microelectronic die, comprising:

a metal interconnect extending through the first die to a back-side of the first die and projecting beyond a recessed surface at the back-side of the die;
a metal contact of the second die aligned with the interconnect;
and
a layer of reflowed metal at least partially surrounding the interconnect and electrically coupling the interconnect to the metal contact of the second die, the layer of reflowed metal conforming to a shape defined by the recessed surface, the interconnect, and the metal contact of the second die.

1 more element

Dependencies are inferred from the claim text.

Surface depressions for die-to-die interconnects and associated systems and methods

Life of this patent

Surface depressions for die-to-die interconnects and associated systems and methods

Life of this patent

Abstract

Claims14