Integrated circuit and method of making

A method of fabricating a circuit, the method comprising:

• providing a die, the die having a side;
• connecting a conductive stud to the side of the die, wherein the conductive stud has a first end that is connected to the die and an opposite second end;
• affixing a first dielectric layer to the side of the die, the first dielectric layer having a first side and a second side, wherein the first side of the first dielectric layer is affixed to the side of the die, and wherein the conductive stud enters the first side of the first dielectric layer;
• and
• affixing a conductive layer to the second side of the first dielectric layer;
• and
• adhering the second side of the conductive stud to the conductive layer using a conductive adhesive.

A circuit comprising:

• a die having a side;
• an encapsulant encapsulating at least a portion of the die other than the side;
• a conductive stud having a first end and an opposite second end, wherein the first end is connected to the side of the die and wherein the conductive stud extends from the side;
• a first dielectric layer having a first side and a second side, wherein the first side of the first dielectric layer is located proximate the side of the die so that the conductive stud extends into the first dielectric layer from the first side and wherein the first dielectric layer is adhered to at least a portion of the encapsulant;
• and
• a conductive layer having a first side and a second side, wherein the first side is located adjacent the second side of the first dielectric layer and proximate the second end of the conductive stud;
• a conductive adhesive adhered to the second side of the conductive stud and the first side of the conductive layer;
• a second dielectric layer adhered to the second side of the conductive layer;
• a via extending through the second dielectric layer;
• and
• a connection mechanism attached to the second dielectric layer and electrically connected to the via.