Integrated circuit packaging system with heat shield and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsReza Argenty Pagaila, Byung Tai Do, Linda Pei Ee Chua
Life of this patent
Estimating the term…
Abstract
A method of manufacture of an integrated circuit packaging system includes: mounting a device mounting structure over a bottom substrate; mounting a heat spreader having an opening formed by a single integral structure with a dam and a flange, the dam having a dam height greater than a flange height of the flange; and forming a package encapsulation over the device mounting structure and the bottom substrate with the device mounting structure exposed within the opening.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- mounting a device mounting structure over a bottom substrate;
- mounting a heat spreader having an opening formed by a single integral structure with a dam and a flange, the dam having a dam height greater than a flange height of the flange;
- and
- forming a package encapsulation over the device mounting structure and the bottom substrate with the device mounting structure exposed within the opening.
A method of manufacture of an integrated circuit packaging system comprising:
- mounting a device mounting structure over a bottom substrate;
- mounting a heat spreader having an opening bounded by a single integral structure with a dam and a flange, the dam having a dam height greater than a flange height of the flange;
- and
- forming a package encapsulation over the device mounting structure and the bottom substrate with the device mounting structure exposed within the opening.
An integrated circuit packaging system comprising:
- a device mounting structure over a bottom substrate;
- a heat spreader having an opening formed by a single integral structure with a dam and a flange, the dam having a dam height greater than a flange height of the flange;
- and
- a package encapsulation over the device mounting structure and the bottom substrate with the device mounting structure exposed within the opening.
Dependencies are inferred from the claim text.