Lead frame and packaging method
AssigneesStmicroelectronics (Shenzhen) Manufacturing Co., Ltd., STMicroelectronics S.r.I.
InventorsHuiJun Xiong, Pierangelo Magni
Life of this patent
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Abstract
There is provided a lead frame and a packaging method. The lead frame comprises a first plurality of die pads, a second plurality of leads extending from the first plurality of die pads, and a third plurality of tie elements, each of which connects one of the first plurality of die pads to another.
Claims8
A lead frame, comprising:
- a first plurality of die pads;
- a second plurality of leads extending from the first plurality of die pads;
- and
- a third plurality of tie elements, each of which connects one of the first plurality of die pads to another.
The lead frame of claim 1, wherein each of the third plurality of tie elements connects two adjacent die pads.
The lead frame of claim 3, wherein each of the third plurality of tie portions connects one die pad to another at respective tab portions.
A lead frame for discrete package, comprising the lead frame of any of claims 1-6.
A method, comprising:
- providing a lead frame having a first plurality of die pads, a second plurality of leads extending from the first plurality of die pads, and a third plurality of tie elements, each of which connects one of the first plurality of die pads to another;
- attaching a first plurality of dice to the first plurality of die pads respectively;
- attaching at least a wire bond between each of the first plurality of dice and the corresponding die pad respectively;
- molding the first plurality of dice;
- and
- cutting off the third plurality of tie elements.
Dependencies are inferred from the claim text.