Integrated circuit packaging system with dual connection and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsZigmund Ramirez Camacho, Henry Descalzo Bathan, Emmanuel Espiritu
Life of this patent
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Abstract
A method of manufacture of an integrated circuit packaging system includes: forming a peripheral lead having a peripheral contact layer surrounding the peripheral lead with a non-horizontal side exposed from the peripheral contact layer; forming an inner lead and a paddle non-planar with the peripheral lead; mounting an integrated circuit to the paddle; and forming an encapsulation covering the integrated circuit and exposing the inner lead, the paddle, and the non-horizontal side.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- forming a peripheral lead having a peripheral contact layer surrounding the peripheral lead with a non-horizontal side exposed from the peripheral contact layer;
- forming an inner lead and a paddle non-planar with the peripheral lead;
- mounting an integrated circuit to the paddle;
- and
- forming an encapsulation covering the integrated circuit and exposing the inner lead, the paddle, and the non-horizontal side.
A method of manufacture of an integrated circuit packaging system comprising:
- forming a peripheral lead having a peripheral contact layer surrounding the peripheral lead with a non-horizontal side exposed from the peripheral contact layer;
- forming an inner lead and a paddle non-planar with the peripheral lead;
- mounting an integrated circuit to the paddle;
- and
- forming an encapsulation covering the integrated circuit and exposing the non-horizontal side, the encapsulation having a recessed portion exposing the inner lead and the paddle.
An integrated circuit packaging system comprising:
- a peripheral lead having a peripheral contact layer surrounding the peripheral lead with a non-horizontal side exposed from the peripheral contact layer;
- an inner lead non-planar with the peripheral lead;
- a paddle non-planar with the peripheral lead;
- an integrated circuit mounted to the paddle;
- and
- an encapsulation covering the integrated circuit and exposing the inner lead, the paddle, and the non-horizontal side.
Dependencies are inferred from the claim text.