US 2013/0075882 A1Published application

Package structure

AssigneeFortune Semiconductor Corporation

InventorsKUO-CHIANG CHEN, ARTHUR SHAOYAN RONG, CHEN HSING LIU, YEN-YI CHEN

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Abstract

A package structure including a first leadframe, a second leadframe, a power pin, a ground pin, a first pin, several first wires, several second wires, and a package body is disclosed. The first leadframe is used for electrically coupling to the drains of a first power transistor and the second power transistor. The ground pin is electrically coupled to the first leadframe. The first pin is connected with the first leadframe through a conductive region used for increasing the amount of current which can be loaded by the first pin. The first wires are used for electrically coupling between the first leadframe and the source of the second power transistor, for reducing the internal resistance of the second power transistor. The second wires are used for electrically coupling between the ground pin and the source of the first power transistor, for reducing the internal resistance of the first power transistor.

Claims10

Dependent claims

A package structure comprising:

a first leadframe, for placing an integrated circuit;
a second leadframe, for placing a first power transistor and a second power transistor, and for electrically coupling drains of the first power transistor and the second power transistor;
a power pin, for electrically coupling to the integrated circuit;
a ground pin coupled to the first leadframe;
a first pin connected with the first leadframe, wherein a conductive region locates at a connecting part of the first pin and the first leadframe, and the conductive region is used for increasing a current amount which can be loaded by the first pin;
a plurality of first wires, for electrically coupling between the first leadframe and a source of the second power transistor, and for reducing an internal resistance of the second power transistor;
a plurality of second wires, for electrically coupling between the ground pin and a source of the first power transistor, and for reducing an internal resistance of the first power transistor;
and
a package body, for covering the first leadframe, the second leadframe, the first wires, the second wires, the integrated circuit, the first power transistor, and the second power transistor, and for partially covering the power pin, the ground pin, and the first pin.

6 more elements

Dependencies are inferred from the claim text.