Semiconductor chip package and method of making same

A semiconductor chip package, comprising:

• a substrate unit, comprising an electrically conductive first seat portion and a plurality of electrically conductive second seat portions surrounding the first seat portion, and defining a plurality of through holes each coated with electrically conducting film for electrically grounding the corresponding second seat portion;
• a chip, assembled on the first seat portion and electrically connected with the substrate unit;
• a plurality of metal members, assembled on the plurality of second seat portions and surrounding the chip, wherein the plurality of metal members are capable of being grounded via the conducting films;
• an electrically non-conductive molding compound, encapsulating the chip and partially encapsulating the plurality of metal members, with part of each of the metal members exposed out of the molding compound;
• and
• an electrically conductive shielding layer, covering the molding compound and the part of each of the metal members exposed out of the molding compound to shield the chip from electromagnetic radiation.