Sealed porous materials, methods for making them, and semiconductor devices comprising them
AssigneesUniversiteit Gent, Imec
InventorsFrederik Goethals, Pascal Van Der Voort, Isabel Van Driessche, Mikhail Baklanov
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Abstract
A method for at least partially sealing a porous material is provided, comprising forming a sealing layer onto the porous material by applying a sealing compound comprising oligomers wherein the oligomers are formed by ageing a precursor solution comprising cyclic carbon bridged organosilica and/or bridged organosilanes. The method is especially designed for low k dielectric porous materials to be incorporated into semiconductor devices.
Claims19
A method for at least partially sealing a porous material comprising:
- providing a porous material;
- and
- forming a sealing layer on the porous material by applying a sealing compound comprising oligomers, wherein the oligomers are formed by ageing a precursor solution comprising at least one member of the group consisting of cyclic carbon bridged organosilica, bridged organosilanes, and combinations thereof, whereby an at least partially sealed porous material is obtained.
An at least partially sealed porous material comprising:
- a first layer of a porous material having pores with a dimension from 2 nm to 50 nm;
- and
- a sealing layer overlying and in physical contact with the first layer, wherein the sealing layer comprises oligomers with at least one of a cyclic carbon bridged organosilica or a bridged organosilane structure and with pores having a dimension not greater than 0.6 nm.
Dependencies are inferred from the claim text.