Chip Comprising a Fill Structure
AssigneeInfineon Technologies AG
InventorsGunther Mackh, Gerhard Leschik, Adolf Koller, Harald Seidl
Life of this patent
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Abstract
A chip includes a dielectric layer and a fill structure in the dielectric layer, wherein the fill structure extends along a dicing edge of the chip, with the fill structure abutting the dicing edge.
Claims25
A chip comprising a dielectric layer and a fill structure in the dielectric layer, wherein the fill structure extends along a dicing edge of the chip, with the fill structure abutting the dicing edge.
A chip comprising a dielectric layer having a dielectric constant smaller than 3.9 and a fill structure in the dielectric layer,
- wherein the fill structure extends along a dicing edge of the chip, with the fill structure abutting the dicing edge along an entire length of the dicing edge, and
- wherein the fill structure forms a periodic structure having a periodic pitch which is smaller than 5 μm.
A wafer comprising a plurality of chip areas separated by at least a dicing line,
- wherein the wafer comprises a dielectric layer, and
- wherein the dielectric layer comprises a fill structure within the dicing line having a width of which is smaller than 25 μm.
A method for manufacturing a plurality of chips, the method comprising:
- providing a wafer comprising a dielectric layer, wherein the wafer comprises a fill structure of the dielectric layer within a dicing line, and a plurality of chip areas separated by at least the dicing line;
- and
- singulating the plurality of chips along the dicing line.
A computer readable digital storage medium having stored thereon a computer program having a program code for performing, when running on a computer, a method for providing a layout of a wafer, the method comprising:
- providing at least two chip layouts;
- arranging the two chip layouts within a common layout of the wafer so that a dicing line is defined between the two chip layouts;
- and
- automatically providing a layout of a periodic fill structure within the dicing line.
Dependencies are inferred from the claim text.