Method for fabricating a three-dimensional inductor carrier with metal core and structure thereof

A method for fabricating a three-dimensional inductor carrier with metal core comprises the steps of:

• providing a substrate having a surface, at least one first bond pad and a protective layer, wherein the first bond pad is disposed on the surface, the protective layer is formed on the surface and comprises at least one first pad opening, a first disposing area and a plurality of second disposing areas, and the first pad opening reveals the first bond pad and is located at the first disposing area;
• forming a first photoresist layer on the protective layer;
• patterning the first photoresist layer to form at least one first opening and a plurality of first apertures, the first opening reveals the first disposing area, and the first apertures reveal the second disposing areas;
• forming a first metal layer within the first opening and the first apertures and enabling the first metal layer to have a first conductive pad and a plurality of first inductor portions, wherein each of the first inductor portions comprises a first connection terminal, a second connection terminal and a first height;
• removing the first photoresist layer;
• forming a first dielectric layer on the protective layer and covering the first metal layer with the first dielectric layer, wherein the first dielectric layer comprises a second pad opening, a plurality of first connection openings and a plurality of second connection openings, wherein the second pad opening reveals the first conductive pad, each of the first connection openings reveals each of the first connection terminals, and each of the second connection openings reveals each of the second connection terminals;
• forming a second photoresist layer on the first dielectric layer;
• patterning the second photoresist layer to form a second aperture, a plurality of third apertures, a plurality of fourth apertures and a slot, wherein the second aperture reveals the first conductive pad, each of the third apertures reveals each of the first connection terminals, each of the fourth apertures reveals each of the second connection terminals, the slot reveals the first dielectric layer and is located between each of the third apertures and each of the fourth apertures, wherein the second aperture comprises a first top, a first depth is formed between the first top and the first conductive pad, each of the third apertures comprises a second top, a second depth is formed between each of the second tops and each of the first connection terminals, each of the fourth apertures comprises a third top, a third depth is formed between each of the third tops and each of the second connection terminals, the slot comprises a fourth top, a fourth depth is formed between the fourth top and the first dielectric layer, and the fourth depth is respectively smaller than the first depth, second depth and third depth;
• forming a second metal layer within the second aperture, the third apertures, the fourth apertures and the slot and enabling the second metal layer to have a second inductor portion, a plurality of third inductor portions, a plurality of fourth inductor portions and a metal core, wherein the second inductor portion is coupled with the first conductive pad and comprises a first top surface and a second height, each of the third inductor portions is coupled with each of the connection terminals and comprises a second top surface and a third height, each of the fourth inductor portions is coupled with each of the first connection terminals and comprises a third top surface and a fourth height, wherein the first height is respectively smaller than the second height, third height and fourth height, the metal core comprises a bottom surface, the first metal layer comprises an upper surface, and a first interval is formed between the bottom surface and the upper surface;
• removing the second photoresist layer;
• forming a second dielectric layer on the first dielectric layer and covering the second metal layer with the second dielectric layer, wherein the second dielectric layer comprises a first exposed hole, a plurality of second exposed holes and a plurality of third exposed holes, the first exposed hole reveals the first top surface, each of the second exposed holes reveals each of the second top surfaces, and each of the third exposed holes reveals each of the third top surfaces;
• forming a third photoresist layer on the second dielectric layer;
• patterning the third photoresist layer to form a fifth aperture and a plurality of sixth apertures, wherein the fifth aperture reveals the first top surface and the second top surface, and each of the sixth apertures reveals each of the second top surfaces and each of the third top surfaces;
• and
• forming a third metal layer within the fifth aperture and the sixth apertures and enabling the third metal layer to have a fifth inductor portion and a plurality of sixth inductor portions, wherein the fifth inductor portion is coupled with the second inductor portion and the third inductor portion, each of the sixth inductor portions is coupled with the third inductor portion and the fourth inductor portion, the fifth inductor portion comprises a fifth height, each of the sixth inductor portions comprises a sixth height, the fifth height is respectively smaller than the second height, third height and fourth height, and the sixth height is respectively smaller than the second height, third height and fourth height.