US 2013/0075781 A1Published application

Led with honeycomb radiating heat dissipation device

AssigneeJingdezhen Fared Technology Co., Ltd.

InventorJeong-Shiun Chen

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Abstract

An LED with a honeycomb radiating heat dissipation device includes a sapphire substrate, an LED epitaxy layer on the sapphire substrate, a thermally conductive binding layer, an intermediate heat dissipation layer, a base substrate and a honeycomb-like heat dissipation device. The thermally conductive binding layer is provided to bind the sapphire substrate and the intermediate heat dissipation layer. The honeycomb-like heat dissipation device is in contact with the base substrate and includes a heat dissipation body and holes, each having a sidewall covered with a thermally radiative heat dissipation film. The intermediate heat dissipation layer and the thermally radiative heat dissipation film is made from a mixture of metal and nonmetal and has a microscopic surface structure with specific crystal, so as to provide high efficiency of heat dissipation by thermal radiation.

Claims6

Dependent claims

A light emitting diode (LED) with a honeycomb radiating heat dissipation device, comprising:

a sapphire substrate having an upper surface and a lower surface;
an LED epitaxy layer formed on the upper surface of the sapphire substrate, including at least an N type semiconductor layer, a semiconductor light emitting layer and a P type semiconductor layer, which are sequentially stacked;
a base substrate having an upper surface and a lower surface;
an intermediate heat dissipation layer formed on the upper surface of the base substrate;
a thermally conductive binding layer provided between the lower surface of the sapphire substrate and the intermediate heat dissipation layer to bind the sapphire substrate and the intermediate heat dissipation layer;
a honeycomb heat dissipation device including a heat dissipation body and a plurality of holes, each having an inner sidewall covered with a thermally radiative heat dissipation film, wherein the honeycomb heat dissipation device is connected to the lower surface of the base substrate;
at least one electrical connection line electrically connecting the N type semiconductor layer and the P type semiconductor layer to a positive end and a negative end of an external power source, respectively;
and
a package body enclosing the LED epitaxy layer,
wherein, the thermally radiative heat dissipation film consists of a mixture of metal and nonmetal, which consists of at least one of silver, copper, tin, aluminum, titanium, iron and antimony, and one of oxide, nitride and inorganic acid of at least one of boron and carbon, and the thermally radiative heat dissipation film has a microscopic structure with crystal.

7 more elements

An LED with a honeycomb radiating heat dissipation device, comprising:

a sapphire substrate having an upper surface and a lower surface;
an LED epitaxy layer formed on the upper surface of the sapphire substrate, including at least an N type semiconductor layer, a semiconductor light emitting layer and a P type semiconductor layer, which are sequentially stacked;
a first thermally radiative heat dissipation film formed on the lower surface of the sapphire substrate;
a honeycomb heat dissipation device having an upper surface and a lower surface, wherein the honeycomb heat dissipation device includes a heat dissipation body and a plurality of holes, and the holes are provided on the lower surface of the honeycomb heat dissipation device, each having an inner sidewall covered with a thermally radiative heat dissipation film;
a second thermally radiative heat dissipation film formed on the upper surface of the honeycomb heat dissipation device;
a thermally conductive binding layer provided between the first thermally radiative heat dissipation film and the second thermally radiative heat dissipation film to bind the first thermally radiative heat dissipation film and the second thermally radiative heat dissipation film;
at least one electrical connection line electrically connecting the N type semiconductor layer and the P type semiconductor layer to a positive end and a negative end of an external power source, respectively;
and
a package body enclosing the LED epitaxy layer,
wherein, the thermally radiative heat dissipation film, each of the first thermally radiative heat dissipation film and the second thermally radiative heat dissipation film consists of a mixture of metal and nonmetal, which consists of at least one of silver, copper, tin, aluminum, titanium, iron and antimony, and one of oxide, nitride and inorganic acid of at least one of boron and carbon, and the thermally radiative heat dissipation film has a microscopic structure with crystal.

7 more elements

Dependencies are inferred from the claim text.