Light emitting device and manufacturing method of the same
AssigneeToyoda Gosei Co., Ltd.
InventorsSeiji Yamaguchi, Koji Tasumi
Life of this patent
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Abstract
The light emitting device 10 comprises a mounting substrate 11, LED chips 20 flip-chip bonded on the mounting substrate 11, and a glass sealing member 30 made of a plate-shaped glass material that seals the LED chips 20 formed on the mounting substrate 11. Here, the glass sealing member 30 is in a state in which fine voids are almost evenly dispersed and distributed between the powder grains of the glass material, and the powder grains are connected with each other, and the fine bumps/dips 30a are almost evenly dispersed and distributed on the surface of the glass sealing member 30.
Claims4
A light emitting device, comprising:
- a mounting substrate;
- LED chips flip-chip bonded on the mounting substrate;
- and
- a glass sealing member formed on the mounting substrate and made of a p ate-shaped glass material that seals the LED chips;
- wherein fine voids are almost evenly dispersed and distributed between powder grains of the glass material, the powder grains are in a state of being connected with each other, and fine bumps/dips are almost evenly dispersed and distributed on a surface of the glass sealing member.
Dependencies are inferred from the claim text.