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US 2013/0075764 A1Published application
Optical module package structure
OwnerChao-Wei YUinventor
Life of this patent
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Abstract
An optical module package structure includes a light-emitting chip and a light sensor chip respectively installed in a first cavity and a second cavity in a substrate, a reflective layer coated on the periphery of the first cavity, two packaging adhesive structures respectively molded in the first cavity and the second cavity to encapsulate the light-emitting chip and the light sensor chip respectively, and a lid integrally formed on the substrate to enhance the airtightness of the whole optical module package structure.
Claims5
An optical module package structure, comprising:
- a substrate defining a light-emitting zone, a light-sensing zone, a first cavity in said light-emitting zone and a second cavity in said light-sensing zone, said first cavity being covered with a reflective layer;
- a light-emitting chip mounted in said first cavity of said substrate and adapted for emitting light;
- a light sensor chip mounted in said second cavity of said substrate and adapted for sensing a light beam;
- two packaging adhesive structures respectively molded in said first cavity and said second cavity to encapsulate said light-emitting chip and said light sensor chip for protection;
- and
- a lid integrally formed on said substrate, said lid comprising a light-emitting hole and a light-sensing hole respectively aimed at said first cavity and said second cavity of said substrate.
3 more elements
Dependencies are inferred from the claim text.