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US 2013/0075727 A1Published application
Semiconductor device
AssigneePanasonic Corporation
InventorsMasao Takahashi, Koji Takemura, Toshihiko Sakashita, Tadaaki Mimura
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Abstract
Electrode pads respectively have a probe region permitting probe contact and a non-probe region. In each of the electrode pads arranged zigzag in two or more rows, a lead interconnect for connecting another electrode pad with an internal circuit is not placed directly under the probe region but placed directly under the non-probe region.
Claims22
1-10. (canceled)
A semiconductor device comprising:
- an electrode pad having a probe region and a non-probe region,
- a pad metal disposed under the probe region, the pad metal electrically connected to the electrode pad, and
- a metal layer disposed under the non-probe region,
- wherein the pad metal and the metal layer are disposed in a same layer.
1 more element
A semiconductor device comprising:
- an electrode pad,
- a probe mark left on the electrode pad,
- a pad metal disposed under the probe mark, the pad metal electrically connected to the electrode pad, and
- a metal layer disposed under the electrode pad in an area outside of the probe mark in plan view,
- wherein the pad metal and the metal layer are disposed in a same layer.
2 more elements
Dependencies are inferred from the claim text.