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US 2013/0075668 A1Published application
Conductive sealant compositions
AssigneePRC-DeSoto International, Inc.
InventorsAhmed Sharaby, Ponchivy Tan
Life of this patent
Estimating the term…
Abstract
Embodiments of the present disclosure are directed to sealant compositions including a base composition with at least one sulfur-containing polymer, a curing agent composition, and an electrically conductive filler including carbon nanotubes and stainless steel fibers. The electrically conductive filler can be in either or both of the base composition and the curing agent composition. The sealant compositions are substantially Ni-free and exhibit unexpectedly superior EMI/RFI shielding effectiveness.
Claims18
A sealant composition, comprising:
- a base composition comprising a sulfur-containing polymer;
- a curing agent composition comprising a curing agent;
- and
- an electrically conductive filler in at least one of the base composition or the curing agent composition, the electrically conductive filler comprising carbon nanotubes and stainless steel fibers.
1 more element
A sealant composition, comprising:
- a substantially nickel-free base composition comprising a sulfur-containing polymer;
- a substantially nickel-free curing agent composition comprising a curing agent;
- and
- a substantially nickel-free electrically conductive filler in at least one of the base composition or the curing agent composition, the electrically conductive filler comprising carbon nanotubes and stainless steel fibers.
1 more element
Dependencies are inferred from the claim text.