Solid state imaging device, portable information terminal device and method for manufacturing solid state imaging device
AssigneeKabushiki Kaisha Toshiba
InventorsKazuhiro SUZUKI, Risako Ueno, Honam Kwon, Mitsuyoshi Kobayashi, Hideyuki Funaki
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Abstract
According to one embodiment, a solid state imaging device includes a sensor substrate having a plurality of pixels formed on an upper face, a microlens array substrate having a plurality of microlenses formed and a connection post with one end bonded to a region between the microlenses on the microlens array substrate and with the other end bonded to the upper face.
Claims20
A solid state imaging device, comprising:
- a sensor substrate having a plurality of pixels formed on an upper face;
- a microlens array substrate having a plurality of microlenses formed;
- and
- a connection post with one end bonded to a region between the microlenses on the microlens array substrate and with the other end bonded to the upper face.
A portable information terminal device comprising:
- a solid state imaging device,
- the solid state imaging device including:
- a sensor substrate having a plurality of pixels formed on an upper face;
- a microlens array substrate having a plurality of microlenses formed;
- and
- a connection post with one end bonded to a region between the microlenses on the microlens array substrate and with the other end bonded to the upper face.
A method for manufacturing a solid state imaging device, comprising:
- forming a plurality of pixels on an upper face of a semiconductor substrate;
- forming a connection post with one end bonded to the upper face;
- forming a plurality of microlenses on a transparent substrate;
- and
- bonding the other end of the connection post to a region between the microlenses on the transparent substrate.
A method for manufacturing a solid state imaging device, comprising:
- forming a plurality of pixels on an upper face of a semiconductor substrate;
- forming a first connection post with one end bonded to the upper face;
- forming a plurality of microlenses on a transparent substrate;
- forming a second connection post with one end bonded to a region between the microlenses on the transparent substrate;
- and
- bonding the other end of the first connection post and the other end of the second connection post together.
A method for manufacturing a solid state imaging device, comprising:
- forming a plurality of pixels on an upper face of a semiconductor substrate;
- forming a concave portion on the upper face;
- forming a plurality of microlenses on a transparent substrate;
- forming a connection post with one end bonded to a region between the microlenses on the transparent substrate;
- and
- fitting the other end of the connection post to the concave portion.
Dependencies are inferred from the claim text.