Manufacturing method of substrate, manufacturing method of wiring substrate, glass substrate and wiring substrate
AssigneeHoya Corporation
InventorsTakashi FUSHIE, Hajime KIKUCHI
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Abstract
There is provided that a substrate comprising a glass substrate 2 constituted by a glass including a silicon oxide. The glass substrate has a through-hole 3 communicating with a front surface and a rear surface of the glass substrate, and filled with a metal material. The substrate is realized by forming an anchor part by selectively etching a silicon oxide on a sidewall surrounding an inside of said through-hole 3 before filling the metal material and by filling the inside of said through-hole 3 with the metal material after forming the anchor part.
Claims12
A manufacturing method of a substrate comprising a glass substrate composed of a glass including a silicon oxide, wherein a through-hole communicating with a front surface and a rear surface of the glass substrate is filled with metal material;
- the method comprising the steps of:
- an etching step of forming an anchor part by selectively etching a silicon oxide located on near a sidewall surrounding an inside of said through-hole before filling with a metal material;
- and
- a filling step of filling the inside of said through-hole with the metal material after said etching step.
A glass substrate composed of a glass including a silicon oxide, wherein
- a through-hole communicating with a front surface and a rear surface of the glass substrate is filled with a metal material;
- and
- an anchor part is formed on a sidewall surrounding an inside of said through-hole and said filled metal penetrates into at least part of roughness of the anchor part.
Dependencies are inferred from the claim text.